Thin Is In – The Challenge and Solution of Picking Thinner Die

MEPTEC/IMAPS presents:Thin Is In – The Challenge and Solution of Picking Thinner Die, by Sarah Parrish, Senior Sales Applications Engineer, Royce Instruments

Wednesday, May 8, 2019 / 11:30 am – 1:00 pm
SEMI Global Headquarters
673 South Milpitas Blvd
Milpitas, CA 95035

To meet today’s device performance and packaging demands, devices are getting thinner at the wafer level. This trend can be seen in wide range of applications spanning multiple industries including medical devices, wearables, power devices, military/space, and automotive and multiple materials including GaN, InP, and Si. With thinner devices allowing improved performance, device flexibility, and reduced package size, implementation of this process requires a robust, high yield process for removal of the devices from the wafer tape after singulation. In this presentation the die removal process will be considered including upstream processing, tooling design, and machine process control, along with a case study for 10 x 10 mm thin die handling. This will then be evaluated against industry direction for new thin device technology and discussion of research and development areas to address these new devices.

Sarah Parrish is currently Senior Sales Applications Engineer for the Royce Instruments product line at V-TEK, Inc. Since joining Royce in 2010, her focus has been to develop solutions to the application challenges and process requirements facing customers in the back-end assembly processes of die sorting and bond testing. Sarah has a BS in Mechanical Engineering and a minor in Global and International Studies from the University of California, Davis.